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A Breakthrough Alternative For Multi-Die Assemblies

Simultaneous Bi-Directional Signaling: A Breakthrough Alternative For Multi-Die Assemblies In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies For full article

Eliyan

Chiplets and the Early Adopter’s Dilemma

Early adopters of a new technology often face a serious dilemma. On one hand, moving early means exploiting the most aggressive new technology available. For full article

Ceva

Ceva Wins Prestigious Industry Award

Ceva Wins Prestigious OFweek China Automotive Industry Award 2024 Ceva-Waves UWB low power ultra-wideband IP named a winner of the Cabin-Driving Integrated Technology Breakthrough Award in China. For full article

Ceva

Alif Semiconductor MCUs Integrates Ceva IPs

Alif Semiconductor MCUs Integrates Ceva IPs for Wireless Connectivity Alif Semiconductor has licensed and deployed Ceva Inc.’s Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs For full article

Ceva

Ceva’s Guide to IoT innovation

TinyML, NPUs and AI SDK: Ceva’s Guide to IoT innovation My guest this week is Chad Lucien from Ceva! Chad and I talk all about the future of edge AI, the advantages of TinyML, and Ceva’s NeuPro NPUs. For full article

Synaptics

Plugable Relaunches Docking Station

Plugable Relaunches UD-6950PDH Docking Station with Upgraded Features and Dual Monitor Support for all Macs Plugable, experts in advanced connectivity, announce the launch of the newly redesigned UD-6950PDH docking station. _ For full article

Eliyan

Eliyan investment takes funding to over $100m

In 2022 it raised $40 million from investors which included the venture arms of Intel and Micron and, in March this year, it raised another $60 million For full article

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