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Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
29 March 2024
The Week’s 10 Biggest Funding Rounds
This March certainly did not go out like a lamb, with seven rounds hitting $100 million or more in the final week. For full article
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28 March 2024
HOW TO BUILD A BETTER “BLACKWELL” GPU
While a lot of people focus on the floating point and integer processing architectures of various kinds of compute engines, For full article
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27 March 2024
Samsung and Tiger Global Back Eliyan
Samsung and Tiger Global Back Silicon Valley Chip Startup Eliyan AI chip tech provider Eliyan Corp. raised $60 million in a Series B funding round co-led by Samsung Catalyst Fund and Tiger Global Management. For full article
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25 March 2024
Eliyan now backed by all major memory firms
Chiplet interconnect startup Eliyan Corp has raised US$60 million in a Series B funding round led by Samsung Catalyst Fund and Tiger Global Management. For full article
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25 March 2024
Eliyan raises $60M
Eliyan raises $60M for chiplet interconnects that speed up AI chips Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips. For full article
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