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Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
11 November 2025
Eliyan joins Arm Total Design
Eliyan Corporation today announced a collaboration with leading compute platform company, Arm. For full article
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27 October 2025
BoW 2.1 Enhancements for New Applications
During the last two decades, increases in compute performance in FLOPs has far outpaced the increases in memory bandwidth, leading to limitations in system For full article
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03 October 2025
Eliyan Joins Dutch Innovation Ecosystem
Eliyan, a fast-growing semiconductor innovator from Silicon Valley, has officially landed at High Tech Campus Eindhoven in the Netherlands. For full article
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15 August 2025
Eliyan: The Ultimate Chiplet Interconnect
It’s been a while since we checked in on semiconductor startups, but they remain one of the best ways to glimpse the industry’s future.  For full article
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16 July 2025
Silicon 100: Startups to Watch in 2025
EE Times’ 25th revision of the Silicon 100, our annual list of 100 high-potential electronics and semiconductor startups, is now available.  For full article
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