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Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
25 March 2024
Eliyan raises $60M
Eliyan raises $60M for chiplet interconnects that speed up AI chips Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips. For full article
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27 February 2024
SEMICON Korea 2024 Takeaways
Memory devices must combine new levels of capacity and power efficiency with higher performance to process the vast amounts of data For full article
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08 February 2024
Chiplet Mission
Chiplet Mission: Navigate Interconnect Complexity Chiplets present a set of multi-layered, multi-faceted, multi-dimensional technology and business problems with no one-size-fits-all answer. For full article
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07 February 2024
Eliyan Sets New Standard for Chiplet Interconnect
Eliyan Corporation has announced the successful tape out of the industry’s highest performing PHY solution for multi-die architectures. For full article
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05 February 2024
Eliyan Breaks Chiplet Memory Wall
Eliyan Breaks Chiplet Memory Wall With Standard Packaging Eliyan recently taped out its NuLink die-to-die PHY IP on TSMC N3, achieving 64 Gbps per bump using standard packaging,  For full article
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