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Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
20 March 2023
Mini-Consortia Forming Around Chiplets
Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows For full article
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16 March 2023
Panel Tackles Chiplet Packaging Challenges
QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California.  For full article
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03 February 2023
Calling All Chiplets!
Calling All Chiplets! Eliyan and the Ultimate Chiplet Interconnect My podcast this week is all about chiplets, chiplet interconnects, and the Bunch of Wires (BoW) chiplet interconnect architecture! For full article
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30 January 2023
Chip Stocks Are Down
Chip Stocks Are Down, But Pockets Of Semiconductor Startup Funding Still Robust For the semiconductor space, these are not looking like the best of times. For full article
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26 January 2023
BoW Strengthens Pathway
BoW Strengthens Pathway to Chiplet Standardization This week’s Chiplet Summit underscores the rapid evolution of the ecosystem around multi-die chip design.  For full article
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